Create Precision PCBs,Leads Unlimited Possibilities
Answer by Customer Service
您好，我们可以做的。
拓普西的PCB生产工艺参数：激光钻孔：0.1-0.15mm 内孔径。
最小BGA焊盘：0.2mm。最小BGA pith： 0.35mm。
最小机械钻孔：0.2mm。最小线宽/线距：3mil（0.075mm）。
建议CSP封装PCB板生产工艺：焊盘做成沉金，或者OSP（抗氧化），过孔做树脂塞孔。
以下是一个Pith 0.35mm和0.4mm的参考图：
如需进一步咨询技术问题也可以直接联系销售工程师。
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