工艺参数 - TUOPX PCB

拓普西 PCB工艺参数---特种PCB专家

序号No	项目Item		技术能力参数Process capability parameter
1	基材 Base material		FR-4 \| High Tg \| Halogen-Free \| PTEE \| Ceramic PCB \| Polyimide
2	印制板类型 PCB type		PCB \| FPC \| R-FPC \| HDI
3	最高层次 Max layer count		64层 64 layer
4	最小基铜厚 Min base copper thickness		1/3 OZ (12um)
5	最大完成铜厚 Max finished copper thickness		30 OZ
6	最小线宽/间距 Min trace width/spacing	内层 Inner layer	2/2mil (H/H OZ base copper)
7	最小线宽/间距 Min trace width/spacing	外层 Outer layer	2.5/2.5mil (H/H OZ base copper)
8	孔到内层导体最小间距 Min spacing between hole to inner layer conductor		6mil
9	孔到外层导体最小间距 Min spacing between hole to outer layer conductor		6mil
10	最小过孔焊环 Min annular ring for via		3mil
11	最小元件孔焊环 Min annular ring for component hole		5mil
12	最小BGA焊盘 Min BGA diameter		8mil
13	最小BGA Pitch Min BGA pitch		0.4mm
14	最小成品孔径 Min hole size		0.15mm(CNC) \| 0.1mm(Laser)
15	最大板厚孔径比 Max aspect ratios		20:1
16	最小阻焊桥宽 Min soldermask bridge width		3mil
17	阻焊/线路加工方式 Soldermask/circuit processing method		菲林 \| 激光直接成像 Film \| LDI
18	最小绝缘层厚 Min thickness for insulating layer		2mil
19	HDI及特种板 HDI & special type PCB		HDI(1-3 steps) \| R-FPC(2-16 layers) \| High frequency mix-pressing(2-14 layers) \| Buried capacitance & resistance ......
20	表面处理类型 Surface treatment type		化学沉金 \| 有铅/无铅喷锡 \| OSP \| 沉锡 \| 沉银 \| 镀厚金 \| 镀银 ENIG \| HAL \| HAL lead free \| OSP \| Immersion Sn \| Immersion silver \| Plating hard gold \| Plating silver
21	最大加工尺寸 Max PCB size		609*889mm

*Advantage：Line width and Line space 2mil（0.05mm),Minimum laser hole reach to 0.05mm, minimum mechanical drilling hole 0.15mm。

Special Material PCB: Multi Rogers Special material domestic or imported,Ro4003,Ro4350,RT5880,RT6002.Taconic,Nelco,Dupont（tly-5, NX9240,AP9121）

isola material like 370HR，FR408, MT40, Shenyi material like SY1000,sh260.7136 etc

Special Technology PCB:Plugged with Resin,Half Hole,Impedance Control,Immersion Tin,ENIG,Rigid-Flex, HDI Buried and Blind hole,Copper thickness 1-30oz,Multi-layer mixed metal substrate pressure,etc.

Urgent delivery Samples: within 24 hours for single/double layers, 48 hours for 4 layers.

For more technology parameters, please contact Mr Wen via cell phone/wechat:13554998058. Sales Dept TEL:0755-23074997（09：00-17:30）

SMT Technology

Item			Conventional Technology常规工艺	Non-Conventional Technology非常规工艺	Remark
SMT PCB Specification	LengthWidth(LW)	Minimum	L ≧ 50mm	L < 50mm	Include Border X/Y
		Minimum	W ≧ 30mm	W < 30mm
		Maximum	L ≦ 460mm	L > 460mm
		Maximum	W ≦ 400mm	W > 400mm
	Thickness(T)	Minimum Thickness	0.4mm	T < 0.4mm
	Thickness(T)	Maximum Thickness	5.0mm	T > 5.0mm
SMT Specification	Size	Minimum Size	0201	01005
		Minimum Size	(0.6mm*0.3mm)	(0.3mm*0.2mm)
		Maximum Size	200mm*125mm	200mm*125mm < SMD
		Thickness	T ≦ 6.5mm	6.5mm < T ≦ 16mm
	QFP、SOP、SOJ、Chip Etc	Minimum PIN Space	0.4mm	0.3mm ≦ Pitch < 0.4mm
	CSP、BGA	Minimum Ball Space	0.5mm	0.3mm ≦ Pitch < 0.5mm

*Advantage：We fully support 01005/0201 chip material，BGA,CSP postting，and provide AOI，X-ray test.and guarantee the pass rate more than 98% for mass production. provide BGA reballing,and after-sales service.

Provide high precision PCB samples,trial production and mass prodution, with Yamaha SMT machine,automatic solder paste printing and inspection.

For more technology parameters, please contact Mr Wen via cell phone/wechat:13554998058. Sales Dept TEL:0755-23074997（09：00-17：30）